Slurry Technology

Wire sawing using slurry, also known as ‘loose abrasive wafering’ (LAW), refers to the process of slicing/lapping ingots with a wire and a liquid mixture (the slurry).

The mixture generally consists of silicon carbide (SiC) and polyethylene glycol (PEG), and is distributed through nozzles onto a moving wire web. As the workpiece to be sliced is lowered onto the wire web, the wires coated with the slurry suspension cut the material into slices.

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Our products

BrickMaster BM 860
Squaring of multi-ingots

BM 860

The BM 860 is the latest generation of bricking solutions based on Meyer Burger’s wire saw technology

Standard Technologies